Thermal Conductive Silicone Thermal Silicon Gel 1.5W/K Two Component Glue Potting for Potting Electronic

Modle Number:	Gw8230
Viscosity, Cps, 25 ºC:	4700-5100
Specific Gravity, g/cm3, 25ºC:	2.6
Mixing Ratio:	a:B=100:100
Thermal Conductivity, W/Mk:	1.5
Transport Package:	Drum

Customization:	Available \| Customized Request

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